行业资讯
共 742 篇 · 来自全球主要半导体媒体、研究机构与公司公告
NVIDIA Expands Advanced Technology Access for Europe’s Scientific Community Through Open Learning Resources, Collaborations and Compute
Much of today’s scientific progress begins with computation. But turning accelerated computing’s potential into scientific progress — modeling climate…
10-15 18:00
Samsung Presents ‘Design Is an Act of Love’ at Seoul Design Week 2026
Samsung Electronics today announced that it is presenting its “Design is an Act of Love” exhibition at Seoul Design Week 2026, taking place in Seoul, …
10-15 18:00
Grid Modernization’s Hidden Cost: A Growing Attack Surface Few Are Watching
Grid modernization is expanding the energy sector’s cyberattack surface, while limited visibility across IT and OT networks leaves connected assets ex…
10-15 16:00
From Smart City to Race Circuit: Samsung’s The Wall in Control Rooms
On the front lines of crisis management, where timely decisions are critical, control rooms are evolving to meet the demands of today’s highly connect…
10-15 16:00
Beyond The Specification: What Really Determines PCIe Retimer Reach?
Multiple interacting factors span silicon design, controller intelligence, channel quality, and the transmission medium itself. The post Beyond The Sp…
10-15 15:07
Strengthening Advanced-Node Interconnects Through Automated Via Insertion
Short-resilient via insertion improves reliability and performance. The post Strengthening Advanced-Node Interconnects Through Automated Via Insertion…
10-15 15:06
Building AI Infrastructure For Greater Choice And Flexibility
Open interfaces and interoperability allow designers to choose technologies based on the needs of the system. The post Building AI Infrastructure For …
10-15 15:03
AMBA C2C: Moving Forward With A Converged AMBA Foundation For C2C Connectivity
Extending chiplet connectivity across AXI and CHI with scalable protocol subsets, interoperability, and flexible transport support. The post AMBA C2C:…
10-15 15:02
Why Open-Weight AI Matters
Proprietary models still hold the edge, but open-weight models add more flexibility for deploying AI. The post Why Open-Weight AI Matters appeared fir…
10-15 15:02
Agentic AI Alters The CPU-GPU Balance
Agentic workloads increase CPU demand, while reasoning models, MoE architectures, and reservoir computing fuel AI acceleration. The post Agentic AI Al…
10-15 15:01
How Close Are We To Fully Autonomous Chip Design?
Synopsys CEO Sassine Ghazi talks about AI agents, the limits of autonomous engineering, digital twins, and the challenges facing 3D-ICs. The post How …
10-15 15:01
Thermal Co-Simulation Testing Of Co-Packaged Optics
Ensuring optical engines can operate reliably alongside high-power AI processors in multi-chip packages. The post Thermal Co-Simulation Testing Of Co-…
10-15 15:01
IBM and Siemens team up to advance 3D nanostack chip technology
IBM and Siemens have announced a research collaboration to advance IBM’s 3D nanostack transistor architecture, targeting the design and manufacturing …
10-15 14:24
DigiKey Invests $100 Million in Distribution Expansion
DigiKey is investing $100 million over the next 18 months to expand its global distribution operations in Thief River Falls, Minnesota. The investment…
10-15 14:00
Samsung Hosts Silicon Valley Future Wireless Summit 2026
Samsung Electronics today announced that it is bringing together global telecommunications industry partners at the Samsung Research America campus in…
10-15 14:00
ASML hits record €11.7 billion sales as AI chip demand surges
ASML reported record third-quarter 2026 sales of €11.7 billion ($13.6 billion), up 25% from the previous quarter, as growing demand for AI chips conti…
10-15 13:49
Siemens invests in Skeleton to tackle AI data center power spikes
Siemens is expanding its AI data center infrastructure portfolio with a strategic investment and exclusive global partnership with Skeleton Technologi…
10-15 13:27
The Nordics and NVIDIA Show What’s Possible When a Region Commits to Advanced Computing
The Nordic countries have become the European leader in unicorn startup density, producing the most emerging companies valued at $1 billion or more pe…
10-15 13:00
TrendForce Forecasts VCSEL Demand to Reach 650 Million Units by 2031
TrendForce projects 38% annual growth as six suppliers develop VCSEL-based near-packaged optics for high-speed data center interconnects. The post Tre…
10-15 10:43
MacDermid Alpha to Highlight Metallization Technologies at IMPACT and TPCA Show 2026
Presentations at IMPACT and TPCA Show 2026 will cover copper plating, via filling, final finishes and glass-via metallization. The post MacDermid Alph…
10-15 10:22