MacDermid Alpha Electronics Solutions will present four technical papers at the IMPACT Conference 2026 and deliver two additional presentations at the Tech X Total Solutions forum during the TPCA Show in Taipei. The presentations will address metallization challenges in printed circuit boards (PCBs) and integrated-circuit substrates, including copper thickness uniformity, via filling, final finishes and through-glass via metallization. Demand from AI, high-performance computing and advanced packaging is driving requirements for finer features and higher interconnect densities. These designs place greater demands on copper distribution, via filling and process control during substrate manufacturing. MacDermid Alpha will discuss periodic pulse reverse (PPR) plating for improving copper thickness uniformity in high-density interconnect (HDI) designs, along with via-filling methods for advanced substrate structures and developments in final finishes. Its PC 710 PPR plating technology targets improved copper uniformity and throwing power in HDI applications. MacuSpec VF-TH 500 and AVF 700 provide via-filling capabilities for demanding substrate and packaging applications. Shadow Plus uses graphite-based direct metallization as an alternative to conventional electroless copper processing. “As the industry pushes the boundaries of PCB and IC substrate technology, manufacturing success increasingly depends on a deep understanding of metallization science and process integration,” said Martin Bunce, Line of Business Director, Secondary Metallization at MacDermid Alpha Electronics Solutions. “We are sharing expertise that helps fabricators address increasingly complex manufacturing challenges and supports reliable, scalable production.” MacDermid Alpha’s technical team will be available at Booth L513 during the TPCA Show 2026 in Taipei to discuss manufacturing challenges and metallization processes. The post MacDermid Alpha to Highlight Metallization Technologies at IMPACT and TPCA Show 2026 appeared first on EE Times Asia .