Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence Ecosystem at SEMICON West 2026, October 13–15, in Booth 5844 at the Moscone Center in San Francisco, California. Highlighting the exhibition will be the worldwide debut of the new SonoFlex™ Acoustic Microscopy Inspection (AMI) System, an innovative platform designed to redefine acoustic inspection performance for back-end advanced semiconductor manufacturing. In addition to SonoFlex, Nordson will showcase a broad range of advanced inspection and metrology solutions designed to enhance yield, process control, and productivity across front-end, mid-end, and back-end semiconductor manufacturing operations. Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will feature two new systems designed to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications. On exhibit will be the new ASYMTEK Vantage XL system, designed to meet throughput and yield demands driven by AI, high-performance computing, and advanced semiconductor packaging applications. Plasma experts will be available to discuss the new MARCH ExoSPHERE and how it enables PLP operations for higher throughput and lower manufacturing costs. Together, these systems help manufacturers accelerate process development and scale advanced packaging production with greater efficiency and control. The post Nordson Debuts SonoFlex Acoustic Inspection System at SEMICON West appeared first on Semiconductor Digest .