行业资讯
共 638 篇 · 来自全球主要半导体媒体、研究机构与公司公告
10-09 08:00
Applied Materials and UCLA to Collaborate on Chip R&D at EPIC Center
Applied Materials, Inc. today announced that the UCLA Samueli School of Engineering will join the company’s EPIC Center in Silicon Valley as a researc…
10-09 05:28
Microchip Introduces Parallel-Sensing Touch Controllers for Industrial Applications
MTCH3380P and MTCH3240P controllers enable fast touch acquisition and robust performance for complex interfaces, including display-free applications. …
10-09 05:26
Astera Labs Unveils PCIe 7 Connectivity Chips for Next-Generation AI Systems
Purpose-built retimers, redrivers, cable modules, optical drivers, and optical transimpedance amplifiers (TIAs) to support diverse PCIe 7 connectivity…
10-09 05:14
GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing…
10-09 05:10
Into the Omniverse: How Developers Turn Ideas Into Simulations With Frontier AI Agents
Turning a simulation idea into a working application means assembling assets, connecting physics and rendering, and checking that the scene behaves as…
10-09 05:06
Micron Plans to Invest Up to $50 Million to Support Genesis Mission Graduate Fellowship and National Laboratory Research
Announced at the White House “Science: A New Golden Age Summit,” investment will develop next generation of U.S. scientists and engineers in advanced …
10-09 04:38
Bluetooth Gets Ultra-Low Latency and Higher Throughput
New Bluetooth human interface device standards add new features.
10-09 04:06
Principal RF Design Engineer
About UsTagoreTech is developing disruptive high-power RF technology for next-generation communication systems. We are a fabless semiconductor company…
10-09 02:42
The Missing Handoff Between Schematic Generation and PCB Layout Automation
The gap between schematic generation and PCB layout reveals a larger problem: Hardware design is still organized as a serial workflow when AI agents c…
10-09 02:34
A Blueprint for Inverting Buck-Boost Compensation
Designing a voltage-loop compensator is critical for buck-boost converters that generate negative voltage rails.
10-09 00:51
Samsung Electronics Announces Earnings Guidance for Third Quarter 2026
Samsung Electronics today announced its earnings guidance for the third quarter of 2026. · Consolidated Sales: Approximately 195 trillion Korean won ·…
10-08 15:49
10-08 08:00
Wolfspeed Secures Conditional $1.5B U.S. Commitment for Domestic SiC Production
Represents another significant step in Wolfspeed’s long-term financing and plan to strengthen its domestic wide bandgap semiconductor technology platf…
10-08 05:12
Aehr Expands AI Chip Burn-In Capacity with $6M Hyperscaler Order
Aehr Test Systems, a provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data ce…
10-08 05:04
MintNeuro Raises $5M to Scale Purpose-Built Chip Platform for Neural Devices and Brain-Computer Interfaces
Funding from European and US investors will accelerate product launch, partner adoption and international expansion. The post MintNeuro Raises $5M to …
10-08 03:20
eFuse Offers Resistor-Adjustable Current Limit, Multiple Protection Features
This tiny 75-V eFuse from Toshiba has adjustable current limit to 6 A along with user-settable capabilities.
10-08 03:10
The U.S. Just Bet $1 Billion on Quantum Chip Manufacturing
The U.S. Department of Commerce has finalized a CHIPS and Science Act R&D award of up to $1 billion for Anderon, a quantum foundry IBM established ear…
10-07 21:09
Reducing Fab Cycle Time: What MES, Dispatching, Scheduling and APC Each Contribute
Dispatching, finite-capacity scheduling, MES, APC and simulation each attack a different share of the time wafers spend waiting, and all of them depen…
10-07 20:55
PerFET™ 60V Power MOSFETs for Automotive
Taiwan Semiconductor introduces its PerFET™ 60V MOSFET technology in PDFN56U (5mm × 6mm) single and dual packages for automotive applications requirin…
10-07 11:27