HANMI Semiconductor today announced that it has opened U.S. subsidiary HANMI USA, a major step in expanding its presence in the U.S. semiconductor market. To celebrate the launch of the new subsidiary, HANMI Semiconductor held an opening ceremony at the HANMI USA office in San Jose, California on October 16 (local time). The event was attended by Chairman Kwak Dong-shin and key company executives. HANMI Semiconductor has taken a leap forward as a global company by opening local subsidiaries that connect the world’s key AI semiconductor regions. Following the establishment of HANMI Taiwan, HANMI China, and HANMI Singapore, HANMI USA further strengthens the company’s global supply chain. HANMI USA will serve as an integrated operational hub in San Jose. Located in Silicon Valley — home to a concentration of global semiconductor companies and major technology firms — the office will strengthen technical support for customers in the U.S. by aligning with the ramp-up schedules of new U.S. fabs being built by global semiconductor companies. HANMI USA’s aim is to anticipate demand by locally stationing experienced engineers and providing hands-on technical support. “The United States is an important market driving the global AI industry and advanced semiconductor technologies,” said Kwak Dong-shin, chairman of HANMI Semiconductor. “HANMI USA will provide close, hands-on technical support to customers in the U.S. and expand collaboration with global semiconductor companies to further strengthen our competitiveness in the global market.” The HANMI USA launch carries special significance because it fulfills the founding vision behind the company’s name 46 years after its establishment. “HANMI” combines the Korean words for Korea (“Han”) and the United States (“Mi”), reflecting the late founding Chairman Kwak Noh-kwon’s aspiration for the company to serve as a bridge between the two countries’ semiconductor industries. Kwak worked at Motorola in the United States for 14 years starting in 1967. With Motorola’s support, he founded HANMI Semiconductor in Korea in 1980, when the country’s semiconductor equipment industry was virtually nonexistent. HANMI Semiconductor has since grown into a global advanced packaging equipment company, and now, the establishment of HANMI USA brings the founder’s vision to fruition. Backed by government industrial policy under the CHIPS and Science Act and large-scale private investment, the United States has emerged as a key production hub for the global AI semiconductor industry. Intel began production using its 18A process and advanced packaging technologies at its fab in Chandler, Arizona in late 2025. Micron is building a new facility in Boise, Idaho, targeting DRAM and HBM production in 2027. The company also broke ground this year on a $100 billion mega-fab in Clay, New York, scheduled to begin operations in 2030. Meanwhile, SK hynix broke ground on an HBM packaging plant in West Lafayette, Indiana in August, with operations scheduled to begin in the second half of 2028. Amkor Technology raised its planned investment in its Peoria, Arizona campus to $12 billion this year, with production slated to begin in early 2028. Notably, Amkor’s new facility will be the first outsourced semiconductor assembly and test (OSAT) facility to be built in the U.S. As the U.S. expands its production capabilities beyond memory and foundry operations into advanced packaging, HANMI Semiconductor expects new growth opportunities in the market. The company holds the No. 1 global market share in TC bonders — a key piece of equipment in HBM manufacturing — and has also become the world’s No. 1 supplier of micro SAW & VISION PLACEMENT (MSVP) equipment. The company supplies foundries and OSATs with AI semiconductor packaging equipment, including three 2.5D TC bonders (2.5D TC Bonder 40 C2S, 2.5D TC Bonder 40 C2W, and 2.5D TC Bonder 120) and two 2.5D FC bonders (FC Bonder 3.5 and FC Bonder 75). HANMI is also expanding its growth eng