Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says

Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC. Samsung Electronics, which has made every part of its HBM stacks in-house, has agreed after an internal review to use TSMC's 3nm process for the base die of NVHBM, Nvidia's next-generation custom HBM, the Seoul Economic Daily reported on October 18, citing industry sources. The newspaper said it would be the first time the two companies have worked together at the HBM manufacturing stage.