瞻芯电子· 2024-12-06 08:00（北京时间） ·重要度 18 TC3Pak顶部散热封装SiC MOSFET，助力高效高密电源设计 TC3Pak（Topside Cooling D3Pak）顶部散热型、表面贴封装1200V碳化硅（SiC）MOSFET产品，具有漏感小、开关损耗低、散热性强、安装方便等特点。 查看详情 封装汽车电子 瞻芯电子 中文 本站仅提供摘要，完整内容请阅读原文（版权归原媒体所有） https://www.inventchip.com.cn/xwzx/Info/430 阅读原文 ↗ 相关阅读 Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains DigiTimes13 小时前 10-18 02:39 ASE unveils 18 advanced packaging projects with three universities DigiTimes2 天前 10-16 15:26 AI Moves to System-Level Co-Design: How Can Taiwan Capture More Value EE Times2 天前 10-16 15:18 Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF DigiTimes2 天前 10-16 14:57 Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China DigiTimes2 天前 10-16 11:53 ZEISS SMT Expands from Lithography Optics into Advanced Packaging Process Control Semiconductor Digest2 天前 10-15 23:41